SMT

The SMT department represents for us a crucial point of our technological development. In this department we have 3 fully automated production lines able to manage large production batches, both small sampling and pre-series batches.

The lines are constantly monitored by the control machines :

- AOI 3D (Automatic optical inspection)

- SPI (Solder Paste Inspection)

- X-RAY

P&P machines can assemble any type of package:

- BGA
- µBGA
- LGA
- QFN
- MFF
- CSP
- POP
- Package Chip size up to 01005