All PCBs that are produced and that host board components with welds not visible as BGA, µBGA, QFN, LGA and components with Exposed Pad, are inspected by an x-ray machine Phoenix 3D can measure the amount of voids in the solder, detect the size and all the quality parameters of the solder ball with extreme reliability and with the drafting of specific photographic documentation. With this machine you can also make on request failure analysis and process controls on mechanical parts.