All PCBs that are produced and that house components with non-visible welds on board such as BGA, µBGA, QFN, LGA and components with Exposed Pad , are inspected using a Phoenix 3D X-Ray machine capable of measuring the amount of voids in the welds , detect the dimensions and all the qualitative parameters of the welding balls with extreme reliability and with the preparation of specific photographic documentation. With this machine, failure analysis and process checks on mechanical parts can also be carried out on request.