The SMT department represents for us a crucial point of our technological development. In this department we have 2 highly efficient fully automated production lines able to manage large production batches, both small batches of sampling and pre-series.
The lines are constantly monitored by the control machines:

AOI 3D (Automatic optical inspection)
SPI (Solder Paste Inspection)
X-RAY.

The P&P can assemble any type of package:
BGA
µBGA
LGA
QFN
QFP
CSP
POP
Package Chip size fino a 01005